Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

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Femtosecond laser micromachining of crystalline silicon for ablation of deep macro-sized cavities for silicon-on-insulator applications

Archive ouverte : Communication dans un congrès

Edité par HAL CCSD ; SPIE

International audience

Langue: Anglais

Date de publication: 2019-02-02

Source: SPIE-Int. Soc. Opt. Eng. 10906 (2019)

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